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Micrel, Inc.
ULTRA-PRECISION 1:8 CML FANOUT BUFFER WITH INTERNAL I/O TERMINATION
Precision Edge SY58031U
Precision Edge(R) SY58031U (R)
FEATURES
Precision 1:8, 400mV CML fanout buffer Guaranteed AC performance over temperature and voltage: * Clock frequency range: DC to >6GHz * <60ps tr / tf time * <270ps tpd * <20ps ouput-to-output skew Low-jitter performance: * <10psPP total jitter (clock) * <1psRMS random jitter * <1psRMS cycle-to-cycle jitter 50 source-terminated CML outputs 400mV CML output swing into 50 load Fully differential I/O Accepts an input signal as low as 100mV Unique, patent-pending input termination and VT pin accepts DC-coupled and AC-coupled differential inputs: (LVPECL, LVDS, and CML) Power supply 2.5V 5% or 3.3V 10% Industrial temperature range: -40C to +85C Available in 32-pin (5mm x 5mm) MLF(R) package Precision Edge(R)
DESCRIPTION
The SY58031U is a 2.5V/3.3V precision, high-speed, fully differential CML 1:8 fanout buffer. The SY58031U is optimized to provide eight identical output copies with less than 20ps of skew and less than 10psPP total jitter. It can process clock signals as fast as 6GHz. The differential input includes Micrel's unique, 3-pin input termination architecture that allows the SY58031U to directly interface to CML, LVPECL, and LVDS differential signals (AC- or DC-coupled) without any level-shifting or termination resistor networks in the signal path. The result is a clean, stub-free, low-jitter interface solution. The CML outputs feature 400mV typical swing into 50 loads and provide an extremely fast rise/fall time guaranteed to be less than 60ps. The SY58031U operates from a 2.5V 5% supply or 3.3V 10% supply and is guaranteed over the full industrial temperature range (-40C to +85C). For applications that require high-speed 1:8 LVPECL fanout buffers, consider the SY58032U and SY58033U. The SY58031U is part of Micrel's high-speed, Precision Edge(R) product line. All support documentation can be found on Micrel's web site at www.micrel.com.
APPLICATIONS
All SONET and all GigE clock distribution All Fibre Channel clock and data distribution Network routing engine timing distribution High-end, low-skew multiprocessor synchronous clock distribution
FUNCTIONAL BLOCK DIAGRAM
Q0 /Q0 Q1 /Q1 Q2 /Q2
IN 50 VT 50 /IN
Q3 /Q3 Q4 /Q4
VREF-AC
Q5 /Q5 Q6 /Q6 Q7
Precision Edge is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc. M9999-020707 hbwhelp@micrel.com or (408) 955-1690
Rev.: C
/Q7
Amendment: /0
1
Issue Date: February 2007
Micrel, Inc
Precision Edge(R) SY58031U
PACKAGE/ORDERING INFORMATION
VCC Q0 /Q0 Q1 /Q1 Q2 /Q2 VCC
Ordering Information(1)
Part Number Package Type MLF-32 MLF-32 MLF-32 MLF-32 Operating Range Industiral Industrial Industiral Industrial Package Marking SY58031U SY58031U SY58031U with Pb-Free bar-line indicator SY58031U with Pb-Free bar-line indicator Lead Finish Sn-Pb Sn-Pb Pb-Free NiPdAu Pb-Free NiPdAu
GND VCC Q3 /Q3 Q4 /Q4 VCC GND
32 31 30 29 28 27 26 25
VCC GND IN VT VREF-AC /IN GND VCC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
24 23 22 21 20 19 18 17
SY58031UMI SY58031UMITR(2) SY58031UMG(3) SY58031UMGTR(2, 3)
32-Pin MLF(R) (MLF-32)
Notes: 1. Contact factory for die availability. Dice are guaranteed at TA = 25C, DC electricals only. 2. Tape and Reel. 3. Pb-Free package recommended for new designs.
PIN DESCRIPTION
Pin Number 3, 6 Pin Name IN, /IN Pin Function Differential Signal Input: Each pin of this pair internally terminates with 50 to the VT pin. Note that this input will default to an indeterminate state if left open. See "Input Interface Applications" section. Input Termination Center-Tap: Each input terminates to this pin. The VT pin provides a center-tap for each input (IN, /IN) to the termination network for maximum interface flexibility. See "Input Interface Applications" section. Ground. Exposed pad must be connected to a ground plane that is the same potential as the ground pin. Positive Power Supply: Bypass with 0.1F0.01F low ESR capacitors as close to the pins as possible. CML Differential Output Pairs: Differential buffered output copy of the input signal. The CML output swing is typically 400mV into 50. Unused output pairs may be left floating with no impact on jitter. See "CML Output Termination" section. Bias Reference Voltage: Equal to VCC-1.2V (typical), and used for AC-coupled applications. See "Input Interface Applications" section. When using VREF-AC, bypass with 0.01F capacitor to VCC. Maximum sink/source current is 0.5mA.
4
2, 7, 17, 24 1, 8, 9, 16 18, 23, 25, 32 31, 30, 29, 28, 27, 26, 22, 21, 20, 19, 15, 14, 13, 12, 11, 10 5
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VCC /Q7 Q7 /Q6 Q6 /Q5 Q5 VCC
VT
GND, Exposed Pad VCC Q0, /Q0, Q1, /Q1, Q2, /Q2, Q3, /Q3, Q4, /Q4, Q5, /Q5, Q6, /Q6, Q7, /Q7 VREF-AC
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Micrel, Inc.
Precision Edge(R) SY58031U
Absolute Maximum Ratings(1)
Power Supply Voltage (VCC ) ...................... -0.5V to +4.0V Input Voltage (VIN) ......................................... -0.5V to VCC Current (VT) Source or sink current on VT pin ........................ 100mA Input Current (VT) Source or sink current on IN, /IN .......................... 50mA Current (VREF) Source or sink current on VREF-AC(3) ....................... 1.5mA Lead Temperature Soldering, (20 sec.) .................... 260C Storage Temperature Range (TS ) ........... -65C to +150C
Operating Ratings(2)
Power Supply Voltage (VCC) ................. +2.375V to +3.60V Ambient Temperature Range (TA) ............. -40C to +85C Package Thermal Resistance(4) MLF(R) (JA) Still-Air ............................................................. 35C/W MLF(R) (JB) Junction-to-Board ............................................ 20C/W
DC ELECTRICAL CHARACTERISTICS(5)
TA= -40C to +85C Symbol VCC ICC VIH VIL VIN VDIFF_IN RIN VT IN VREF-AC Parameter Power Supply Voltage Power Supply Current Input HIGH Voltage Input LOW Voltage Input Voltage Swing Differential Input Voltage Swing |IN0, /IN0|, |IN1, /IN1| In-to-VT Resistance Max. In-to-VT (IN, /IN) Condition 2.5V nominal 3.3V nominal VCC = max. no lead. Includes current through 50 pull-ups. IN1, /IN1 IN1, /IN1 IN1, /IN1, see Figure 1a. IN1, /IN1, see Figure 1b. VCC-1.2 0 0.1 0.2 40 50 60 1.28 VCC-1.3 VCC-1.2 VCC-1.1 Min 2.375 3.0 Typ 2.5 3.3 265 Max 2.625 3.6 330 VCC VIH-0.1 1.7 Units V V mA V V V V V V
CML DC ELECTRICAL CHARACTERISTICS(5)
VCC = 2.5V 5% or 3.3V 10%; RL = 100 across Q and /Q; TA= -40C to +85C, unless otherwise stated. Symbol VOH VOUT VDIFF_OUT ROUT
Notes: 1. Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. JB uses 4-layer JA in still-air number unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above tables after thermal equilibrium has been established.
Parameter Output HIGH Voltage Output Voltage Swing Differential Voltage Swing Output Source Impedance
Condition
Min VCC-0.020
Typ
Max VCC
Units V mV mV
see Figure 1a. see Figure 1b.
325 650 40
400 800 50 60
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Micrel, Inc
Precision Edge(R) SY58031U
AC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V 5% or 3.3V 10%; RL = 100 across each output pair or equivalent; TA = -40C to +85C, unless otherwise stated. Symbol fMAX tpd tpd tempco tSKEW tJITTER Parameter Maximum Operating Frequency Propagation Delay (IN-to-Q) Condition VOUT 200mV Clock Min 6 120 230 35 Note 8 Note 9 Cycle-to-Cycle Total Jitter (Clock) Random Jitter (RJ) tr, tf
Notes: 7. 8. 9. High frequency AC electricals are guaranteed by design and characterization. All outputs loaded, VIN 100mV. Output-to-output skew is measured between outputs under identical transitions. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs. Part-to-part skew includes variation in tpd.
Typ
Max
Units GHz
270
ps fs/C
Differential Propagation Delay Temperature Coefficient Output-to-Output (Within Device) Part-to-Part Clock
7
20 100 1 10 1
ps ps psRMS psPP psRMS ps
Note 10 Note 11 Note 12 20% to 80%, at full output swing 20 45
Output Rise/Fall Time
60
10. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn-Tn-1 where T is the time between rising edges of the output signal. 11. Total jitter definition: With an ideal clock input of frequency fMAX, no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. 12. Random jitter is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 2.5Gbps.
SINGLE-ENDED AND DIFFERENTIAL SWINGS
VIN, VOUT 400mV (Typ.)
VDIFF_IN, VDIFF_OUT 800mV (Typ.)
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
TIMING DIAGRAM
/IN VIN IN tpd /Q VOUT Q tpd
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Micrel, Inc.
Precision Edge(R) SY58031U
TYPICAL OPERATING CHARACTERISTICS
VCC = 2.5V, GND = 0, VIN = 100mV, TA = 25C, unless otherwise stated.
200MHz Output
2.5GHz Output
Output Swing (100mV/div.)
Output Swing (100mV/div.)
TIME (600ps/div.) 7GHz Output
TIME (50ps/div.)
Output Swing (100mV/div.)
TIME (20ps/div.)
Amplitude vs. Frequency
4.0 3.5 3.0 SKEW (ps) 2.5 2.0 1.5 1.0 0.5
Output-to-Output Skew vs. Temperature
500 450 400 350 300 250 200 150 100 50 0
AMPLITUDE (mV)
VIN = 200mV
0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
0.0 -40 -20 0
20 40 60 80 100 120
TEMPERATURE (C)
FREQUENCY (MHz)
202 200 198 196 194 192 190 188 186 184 182 180 100 200 300 400 500 600 700 800 INPUT SWING (mV)
Propagation Delay vs. Input Swing
195 PROPAGATION DELAY (ps)
Propagation Delay vs. Temperature
VIN = 400mV
PROPAGATION DELAY (ps)
190
185
180
175 -40 -20 0
20 40 60 80 100 120
TEMPERATURE (C)
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Micrel, Inc
Precision Edge(R) SY58031U
INPUT BUFFER
VCC
IN 50 VT 50 /IN GND
Figure 2. Simplified Differential Input Buffer
INPUT INTERFACE APPLICATIONS
VCC VCC
VCC VCC
VCC
VCC
IN CML /IN SY58031U GND NC NC VREF-AC VT
IN LVPECL /IN SY58031U
IN CML /IN
GND
VCC GND 0.01F SY58031U VREF-AC VT
VREF-AC VT 0.01F Rpd
VCC
Option: May connect VT to VCC.
For 2.5V, Rpd = 19 For 3.3V, Rpd = 50
Figure 3a. DC-Coupled CML Input Interface
Figure 3b. AC-Coupled CML Input Interface
Figure 3c. LVPECL Input Interface
VCC
VCC
VCC VCC
IN LVPECL /IN Rpd GND GND For 3.3V, Rpd = 100 For 2.5V, Rpd = 50 Rpd VT VREF-AC
GND NC NC LVDS IN
SY58031U
/IN SY58031U VREF-AC VT
VCC
Figure 3d. AC-Coupled LVPECL Input Interface
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Figure 3e. LVDS Input Interface
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Micrel, Inc.
Precision Edge(R) SY58031U
CML OUTPUT TERMINATION
Figure 4 and Figure 5 illustrate how to terminate a CML output using both the AC- and DC-coupled configuration. All outputs of the SY58031U are 50 with a 16mA current source.
VCC SY58031U 50 50 Q
VCC SY58031U 50 ZO = 50 100 /Q ZO = 50 /Q 50 ZO = 50 DC bias per application 16mA 50 Q ZO = 50 50
16mA
GND
GND
Figure 4. CML DC-Coupled Termination
Figure 5. CML AC-Coupled Termination
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION
Part Number SY58031U SY58032U SY58033U Function Ultra-Precision 1:8 CML Fanout Buffer with Internal I/O Termination Ultra-Precision 1:8 LVPECL Fanout Buffer with Internal Termination Ultra-Precision 1:8 400mV Fanout Buffer with Internal Termination 32-MLF(R) Manufacturing Guidelines Exposed Pad Application Note HBW Solutions Data Sheet Link http://www.micrel.com/product-info/products/sy58031u.shtml http://www.micrel.com/product-info/products/sy58032u.shtml http://www.micrel.com/product-info/products/sy58033u.shtml www.amkor.com/products/notes_papers MLF_AppNote.pdf http://www.micrel.com/product-info/as/solutions.shtml
M9999-020707 hbwhelp@micrel.com or (408) 955-1690
7
Micrel, Inc
Precision Edge(R) SY58031U
32-PIN MicroLeadFrame(R) (MLF-32)
Package EP- Exposed Pad
Die
CompSide Island
Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane
PCB Thermal Consideration for 32-Pin MLF(R) Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: 1. 2. 3. Package meets Level 2 qualification. All parts are dry-packaged before shipment. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2005 Micrel, Incorporated. M9999-020707 hbwhelp@micrel.com or (408) 955-1690
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